Model: KOH YOUNG – Neptune C+ 3D Optical Measurement for Transparent Materials Thickness System
Key Benefits:
3D Inspection:
- Coating thickness measurement on complex PCB structures, such as soldered pads, i-Sn, IC component leads, solder joints, etc., along with underfill width and height measurement.
2D Inspection:
- Inspection of coating/non-coating areas, bubbles, cracks, foreign material, and underfill.
Specifications:
- Pixel: 12M (4096 x 3072)
- Lateral Resolution (X, Y): 15µm (2D Camera) / 20µm (3D Camera: LIFT)
- Axial Resolution (Z): 10µm
- Measurement Range: 10µm ~ 3.0mm (Z Axis, Depth)
- Min/Max PCB Size: 50 x 50mm ~ 500 x 500mm (Standard Type)
- Min/Max PCB Size: 100 x 100mm ~ 500 x 500mm (Flipper Type)
- PCB Thickness: 0.4 ~ 5mm (Standard Type), 1 ~ 5mm (Flipper Type)
- Max PCB Weight: 5kg (Standard Type), 2kg (Flipper Type)
Additional Features:
- Touch Screen Monitor Upgrade
- DPI Multifunction Target