HITEM HAS ACQUIRED A NEW 3D SOLDER PASTE INSPECTION MACHINE

MYCRONIC PL-PICO 3D Solder Paste Inspection

Measurements: Height, Area, Volume, Offset. Bridging, Shape 2D, Shape 3D, Coplanarity

Defect types: Insufficient/Excessive/Missing paste, Bridge. Shape 2D. Shape 3D.User defined defect, Paste pollution

Minimum paste/glue deposit size: 100µm x 100µm

Maximum paste/glue deposit size: 20 mm x 20mm

Maximum paste height: 400µm (consult for higher paste height)

Height resolution: lÖÖnm

Height accuracy : <2µm on Certification target at operating temperature

Height repeatability: < 1µm at 3σ on Certification target at operating temperature

Volume repeatability: < 3% at 30 on PCB at operating temperature

Inspection speed: 3 sec. per Field of View

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