(HiTEM) provides value-added services in all of its offerings. These include new product introduction teams, advanced manufacturing and test engineering, flexible materials management, comprehensive testing, product diagnostics, and repair, package, order fulfillment and distribution.
HiTEM integrates components, including its printed circuit card, cable and harness assemblies, into higher-level sub-assemblies and total system assemblies. In addition to product assemblies, HiTEM also provides services to customers seeking to integrate manufacturing and distribution activities, including custom configuration; documentation; packaging and order fulfillment.
Printed circuit cards are platforms on which integrated circuits and other electronic components are mounted. In addition to traditional surface mount technologies, HiTEM employs advanced surface mount technologies, primarily micro-ball grid array in its printed circuit board assembly operations. HiTEM also continues to support though-hole technology and related semi-automated and manual placement processes for existing and new applications.
HiTEM focuses on low-to-moderate-volume manufacturing of highly complex printed circuit card assemblies. The company manufactures these complex assemblies on a catch basis and has developed expertise in quickly changing equipment set-up and manufacturing capabilities in order to respond to customers’ changing needs.
HiTEM offers a wide range of cable and harness assembly services for molded and mechanical applications. These include custom-manufactured ribbon assemblies, multi conductor, co-axial and fiber optic cable assemblies and discrete wire harness assemblies.
HiTEM specializes in board repair, rework, and full system tests with quick-turn around time of 24 hours to 10 working days. We are capable of adding and cutting traces if necessary. Redesign of boards is possible and at HiTEM we advise our customers on designing for manufacturability.
HiTEM is able to take added measures to mitigate tin and reduce the effect of tin whiskers on its assemblies. For BGA rework and re-balling, HiTEM uses many differently sized stencils, and solder balls of various sizes in lead or lead-free form.
In addition to the standard mount and assembly services, HiTEM also provides the ability to X-ray components and PCBs for possible abnormalities/defects. Our board washing services have assisted companies in reducing the effect of shortages caused by excess flux. Other services not listed or mentioned may also be quoted at HiTEM.